Sn-Ag-Cu Solder

Tin-lead solder owns many advantages including low melting point,excellent wettability and low cost ,so it was widely applied in the industry of electronic packaging ,for instance,the joint of electronic component leads and PCB pad.However as a toxic metallic element,lead and its compounds are already listed as hazardous substance,and projibited as well in RoHS.In this case,it is evident that tin-lead solder will be repalced by lead-free solde.

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Details

Sn-Ag-Cu solder


Standard

Own Standard

Sn

Ag


Cut

Melting Temperature Range

Applied Base Metal


S-Sn96Ag4Cu


Balance

3.7~4.3

0.3~0.7

217~229

Brazing Steel and Copper Alloys in electric and food industries etc.


S-Sn98Cu1Ag


Balance

0.2~0.4

0.5~0.9

217~227

Brazing Steel and Copper Alloys in electric and food industries etc


S-Sn95Cu4Ag1


Balance

0.8~1.2

3.5~4.5

217~353

Brazing Steel and Copper Alloys in electric and food industries etc


S-Sn92Cu6Ag2


Balance

1.8~2.2

5.5~6.5

217~380

Brazing Steel and Copper Alloys in electric and food industries etc


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Preform Dimension

Form

Wire Dia

Length

ID (inner diameter)

Width

Thickness

Rod

0.5---5.0

3---1000




Ring

0.5---3.0


5---120



Wire

0.5—2.0





Foil




1.5--120

0.25--2

Strip




1.5--120

0.25--2

If you require special dimension, please call or email directly.

Hot Tags: sn-ag-cu solder, China, manufacturers, suppliers, high-quality, pb-free solder

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